Full chip electro-thermal simulation of power devices

  • 3D electro-thermal analysis
  • Self-consistent electro-thermal solution
  • Transient and static electro-thermal simulation modes
  • Accuracy verified versus silicon
  • Non-linear temperature-dependencies supported
  • Provides ability to optimize temperature and current sensor locations
  • Provides ability to calculate thermal interaction between power devices
  • Allows thermal floor planning
  • Visualization of temperature, flux and power
  • Supports the distributed nature of power devices