2012.3.6 Integrated Device Technology (IDT) Picks Silicon Frontline to Improve Power Device Reliability and Efficiency

R3D offers Accurate Extraction and Analysis of Power Devices

Campbell, CA – March 6, 2012 – Silicon Frontline Technology, Inc. (SFT) an Electronic Design Automation (EDA) company, in the post-layout verification market, announced today that Integrated Device Technology, Inc. , the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, is using Silicon Frontline’s R3D software for fast, resistive 3D extraction. R3D improves the reliability and efficiency of semiconductor power devices offered by IDT.

“After extensive evaluations of various options, we determined that Silicon Frontline’s R3D software is the best approach available in terms of speed, accuracy and usability to meet the reliability and efficiency goals of our power device designs,” stated Scott Woods, Director Design Automation at IDT.

“We are proud to have IDT select R3D to verify and improve the quality of their power devices, said Yuri Feinberg, SFT CEO. “With today’s requirements to support multiple power domains, the demands on power device designers continue to escalate. Optimizing today’s power device designs for reliability and efficiency can only be achieved with R3D post-layout extraction software.”

Why 3D Extraction Is Important for Power Device Design
The quality of a power device is determined by its efficiency and reliability. While efficiency is determined by the Rdson (a lower Rdson providing higher efficiency), current density is a major contributor to reliability. As power devices do not adhere to the typical rectangular routing, traditional extraction techniques fail to provide the desired results. Similar challenges exist for simulation, as the complexity of the design requires handling many million devices, which even if the capacity can be handled leads to overly long runtimes.

Silicon Frontline’s R3D combines 3D extraction with a new analysis engine to handle the accuracy and capacity requirements with a fast turnaround. To date R3D has been adopted by over 20 customers and applied to MOS, DMOS, LDMOS, vertical DMOS, waffle-style and GaN HEMT designs.

About Silicon Frontline’s Products and Customers
F3D (Fast 3D) is used for fast 3D extraction and R3D (Resistive 3D) is used for 3D extraction and analysis of large resistive structures. F3D is chosen for its nanometer and Analog Mixed Signal (A/MS) design verification accuracy, and R3D for analysis that leads to improvements in the reliability and efficiency of semiconductor power devices. H3D is the industry’s first commercial hierarchical 3D extractor, for post-layout verification. H3D offers hierarchical parasitic extraction, hierarchical netlisting, unlimited capacity, and field-solver accuracy.

SFT’s products work with design flows from the leading EDA suppliers. The company’s customers are in North America, Japan, Asia and Europe. Target markets include memory, Analog Mixed Signal (A/MS), image sensors, power devices and high-speed nanometer designs.

About Silicon Frontline
Silicon Frontline Technology, Inc. provides post-layout verification software that is Guaranteed Accurate and works with existing design flows from major EDA vendors. Using new 3D technology, the company’s software products improve silicon quality for standard and advanced nanometer processes. For more information please visit www.siliconfrontline.com. For sales or general assistance, please email info@SiliconFrontline.com.

Press Contact:
Georgia Marszalek, ValleyPR LLC, +1 650 345 7477, Georgia@ValleyPR.com

Notes to editors:

Acronyms and Definitions
A/MS: Analog Mixed Signal
DMOS: Double-diffused Metal Oxide Semiconductor
EDA: Electronic Design Automation
GaN: Gallium Nitride
HEMT: High Electron Mobility Transistor
LDMOS: Laterally Diffused Metal Oxide Semiconductor
MOS: Metal Oxide Semiconductor
R3D: Resistive 3D
Rdson: Resistance from drain to source

All trademarks and tradenames are the property of their respective holders.

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